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General Information
    • ISSN: 2382-6185
    • Abbreviated Title: Int. J. Knowl. Eng.
    • Frequency: Semiyearly
    • DOI: 10.18178/IJKE
    • Editor-in-Chief: Prof. Chen-Huei Chou
    • Executive Editor: Ms. Nina Lee
    • Indexed by: Google Scholar, Crossref, ProQuest
    • E-mail: ijke@ejournal.net
Prof. Chen-Huei Chou
College of Charleston, SC, USA
It is my honor to be the editor-in-chief of IJKE. I will do my best to help develop this journal better.
IJKE 2019 Vol.5(2): 72-75 ISSN: 2382-6185
doi: 10.18178/ijke.2019.5.2.121

Intellectual Property: How Well Undergraduate Students Aware of?

Kelvin C. K. Wong, Fion S. L. Lee, and Martin M. T. Choy
Abstract—The massive worldwide growth in knowledge economy has led to an increase in the use of intellectual property. The protection of it can help to encourage the creation of new works by giving creators the control of and the rewards from their hard work. In the commercial side, intellectual property assets become more valuable to business. There is an increasing need to protect them in order to make the business success. In order to develop Hong Kong as an intellectual property trading hub in Asia-Pacific region, the Intellectual Property Department conducted a lot of studies on IP trading and management, workforce engaged in them and the public’s awareness of the intellectual protection rights. However, there is a lack of studies in Hong Kong students’ awareness and knowledge of intellectual property. The purpose of this study aims to explore Hong Kong undergraduate students’ existing awareness of intellectual property and knowledge of copyright.

Index Terms—Intellectual property, copyright, gender difference.

The authors are with the Department of Computer Science, Hong Kong Baptist University, Hong Kong (e-mail: kckwong@comp.hkbu.edu.hk, fionlee@comp.hkbu.edu.hk, mtchoy@comp.hkbu.edu.hk).


Cite: Kelvin C. K. Wong, Fion S. L. Lee, and Martin M. T. Choy, "Intellectual Property: How Well Undergraduate Students Aware of?," International Journal of Knowledge Engineering vol. 5, no. 2, pp. 72-75, 2019.

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E-mail: ijke@ejournal.net